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LMZ10501SH Datasheet(PDF) 18 Page - Texas Instruments |
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LMZ10501SH Datasheet(HTML) 18 Page - Texas Instruments |
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18 / 25 page ![]() INPUT CAPACITOR OUTPUT CAPACITOR FEEDBACK TRACE VIN VOUT VCON CAPACITOR VREF VIN PGND VOUT SGND FB SGND CONNECTION TO QUIET PGND PLANE VCON EN RT RESISTOR RB RESISTOR HIGH di/dt LOOP KEEP IT SMALL PGND LMZ10501 SNVS677D – MAY 2011 – REVISED MARCH 2013 www.ti.com Board Layout Considerations Figure 39. Example Top Layer Board Layout The board layout of any DC-DC switching converter is critical for the optimal performance of the design. Bad PCB layout design can disrupt the operation of an otherwise good schematic design. Even if the regulator still converts the voltage properly, the board layout can mean the difference between passing or failing EMI regulations. In a Buck converter, the most critical board layout path is between the input capacitor ground terminal and the synchronous rectifier ground. The loop formed by the input capacitor and the power FETs is a path for the high di/dt switching current during each switching period. This loop should always be kept as short as possible when laying out a board for any Buck converter. The LMZ10501 integrates the inductor and simplifies the DC-DC converter board layout. Refer to the example layout in Figure 39. There are a few basic requirements to achieve a good LMZ10501 layout. 1. Place the input capacitor CIN as close as possible to the VIN and PGND terminals. VIN (pin 7) and PGND (pin 6) on the LMZ10501 are next to each other which makes the input capacitor placement simple. 2. Place the VCON filter capacitor CVC and the RB RT resistive divider as close as possible to the VCON and SGND terminals.The CVC capacitor (not RB) should be the component closer to the VCON pin, as shown in Figure 39. This allows for better bypass of the control voltage set at VCON. 3. Run the feedback trace (from VOUT to FB) away from noise sources. 4. Connect SGND to a quiet GND plane. 5. Provide enough PCB area for proper heatsinking. Refer to the Electrical Characteristics table for example θJA values for different board areas. Also, refer to AN-2020 for additional thermal design hints. Refer to the evaluation board application note AN-2166 for a complete board layout example. 18 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LMZ10501 |
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