TPS62691 datasheet(2/28 Pages) TI

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TPS62690

TPS62691

TPS62697

SLVS965B

– MARCH 2011 – REVISED JANUARY 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION(1)

PACKAGE

PART

OUTPUT

DEVICE

ORDERING(3)

MARKING

NUMBER

VOLTAGE(2)

SPECIFIC FEATURE

CHIP CODE

TPS62690

2.85V

500mA peak output current

TPS62690YFF

-40

°C to 85°C

TPS62691(4)

2.2V

600mA peak output current

TPS62691YFF

TPS62697

2.8V

500mA peak output current

TPS62697YFF

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Internal tap points are available to facilitate output voltages in 25mV increments.

(3)

The YFF package is available in tape and reel. Add a R suffix (e.g. TPS62690YFFR) to order quantities of 3000 parts. Add a T suffix

(e.g. TPS62690YFFT) to order quantities of 250 parts.

(4)

Product preview. Contact TI factory for more information.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage at VIN(2)(3), SW(3)

–0.3

Input Voltage

Voltage at FB(3)

–0.3

3.6

Voltage at EN, MODE (3)

–0.3

VI + 0.3

TPS62690,

500

TPS62697

Peak output current, IO

TPS62691

600

Power dissipation

Internally limited

Operating temperature range, TA

(4)

–40

°C

Operating junction temperature, TJ

150

°C

Storage temperature range, Tstg

–65

150

°C

Human body model

ESD(5)

Charge device model

Machine model

200

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Operation above 4.8V input voltage is not recommended over an extended period of time.

(3)

All voltage values are with respect to network ground terminal.

(4)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is

recommended to operate the device with a maximum junction temperature of 105

°C.

(5)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin. The machine model is a 200-pF

capacitor discharged directly into each pin.

THERMAL INFORMATION

TPS62690

THERMAL METRIC(1)

UNITS

YFF (6 PINS)

θJA

Junction-to-ambient thermal resistance

133.2

θJCtop

Junction-to-case (top) thermal resistance

1.4

θJB

Junction-to-board thermal resistance

22.5

°C/W

ψJT

Junction-to-top characterization parameter

5.5

ψJB

Junction-to-board characterization parameter

22.3

θJCbot

Junction-to-case (bottom) thermal resistance

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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