TSL238

HIGH-SENSITIVITY

LIGHT-TO-FREQUENCY CONVERTER

TAOS073J − SEPTEMBER 2008

8

r

r

Copyright

E 2008, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

MECHANICAL DATA

This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically

nonconductive clear plastic compound having an index of refraction of 1.55.

PACKAGE D

PLASTIC SMALL-OUTLINE

A

1.75

1.35

0.50

0.25

4.00

3.80

6.20

5.80

45

5

0.88 TYP TOP OF

SENSOR DIE

5.00

4.80

5.3

MAX

1.27

0.41

0.25

0.10

0.25

0.19

DETAIL A

PIN 1

6

0.510

0.330

8

y

j 2.8 TYP

CLEAR WINDOW

NOTE B

PIN 1

TOP VIEW

BOTTOM VIEW

SIDE VIEW

END VIEW

Lead Free

Pb

NOTES: A. All linear dimensions are in millimeters.

B. The center of the 0.84-mm by 0.84-mm photo-active area is located in the center of the package

± 0.25 mm.

C. Pin 4 is resistively coupled to the substrate of the die, which is at the same potential as Pin 6. Pin 4 must either be connected to

Pin 6 or left unconnected. Pin 4 cannot be used as the sole ground connection.

D. Leads are plated with Pd (min 0.1

μ inch) + Ni (min 10 μ inch) + Au (min 0.1 μ inch).

E. This drawing is subject to change without notice.

Figure 9. Package D — Plastic Small Outline IC Packaging Configuration