TSL2550

AMBIENT LIGHT SENSOR

WITH SMBus INTERFACE

TAOS029L − OCTOBER 2007

17

The LUMENOLOGY r Company

r

r

Copyright E 2007, TAOS Inc.

www.taosinc.com

MANUFACTURING INFORMATION

The D and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB

substrate. The process, equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat exposure of components during the solder

reflow process of product on a PCB. Temperature is measured on top of component. The components should

be limited to a maximum of three passes through this solder reflow profile.

Table 5. TSL2550 Solder Reflow Profile

PARAMETER

REFERENCE

TSL2550D/TSL2550T

Average temperature gradient in preheating

2.5°C/sec

Soak time

2 to 3 minutes

Time above 217°C

Max 60 sec

Time above 230°C

Max 50 sec

Max 10 sec

Peak temperature in reflow

260° C (−0°C/+5°C)

Temperature gradient in cooling

Max −5°C/sec

Not to scale — for reference only

Time (sec)

Figure 14. TSL2550D/TSL2550T Solder Reflow Profile Graph