LPC1763 datasheet(45/86 Pages) PHILIPS

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LPC1769_68_67_66_65_64_63

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Product data sheet

Rev. 9.3 — 8 January 2014

45 of 86

NXP Semiconductors

LPC1769/68/67/66/65/64/63

32-bit ARM Cortex-M3 microcontroller

10. Thermal characteristics

The average chip junction temperature, Tj (C), can be calculated using the following

equation:

(1)

• Tamb = ambient temperature (C)

• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)

• PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is often small and many times can be negligible. However it can be significant

in some applications.

Table 7.

Thermal resistance (

15 %)

Symbol Parameter

Conditions

Max/Min

Unit

LQFP100

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still air

38.01

C/W

Single-layer (4.5 in

 3 in); still air 55.09

C/W

Rth(j-c)

thermal resistance from

junction to case

9.065

C/W

TFBGA100

Rth(j-a)

thermal resistance from

junction to ambient

JEDEC (4.5 in

 4 in); still air

55.2

C/W

Single-layer (4.5 in

 3 in); still air 45.6

C/W

Rth(j-c)

thermal resistance from

junction to case

9.5

C/W

amb

th j

–







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