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LPC1763 Datasheet(PDF) 79 Page - NXP Semiconductors |
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LPC1763 Datasheet(HTML) 79 Page - NXP Semiconductors |
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79 / 86 page ![]() LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved. Product data sheet Rev. 9.3 — 8 January 2014 79 of 86 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 41. Reflow soldering of the TFBGA100 package DIMENSIONS in mm PSL SP SR Hx Hy Hx Hy SOT926-1 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA100 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot926-1_fr 0.80 0.330 0.400 0.480 9.400 9.400 |
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