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BSS138 Datasheet(PDF) 1 Page - Diodes Incorporated |
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BSS138 Datasheet(HTML) 1 Page - Diodes Incorporated |
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1 / 5 page ![]() DS30144 Rev. 6 - 2 1 of 5 BSS138 www.diodes.com BSS138 N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR Features · Low On-Resistance · Low Gate Threshold Voltage · Low Input Capacitance · Fast Switching Speed · Low Input/Output Leakage Maximum Ratings @ TA = 25 °C unless otherwise specified Characteristic Symbol BSS138 Units Drain-Source Voltage VDSS 50 V Drain-Gate Voltage RGS £ 20KW VDGR 50 V Gate-Source Voltage Continuous VGSS ±20 V Drain Current Continuous ID 200 mA Power Dissipation (Note 1) Pd 300 mW Thermal Resistance, Junction to Ambient (Note 1) RqJA 417 °C/W Operating and Storage Temperature Range Tj,TSTG -55 to +150 °C · Case: SOT-23, Molded Plastic · Case Material - UL Flammability Classification Rating 94V-0 · Moisture sensitivity: Level 1 per J-STD-020A · Terminals: Solderable per MIL-STD-202, Method 208 · Terminal Connections: See Diagram · Marking (See Page 2): K38 · Ordering & Date Code Information: See Page 2 · Weight: 0.008 grams (approx.) Mechanical Data A E J L TOP VIEW M B C H G D K D G S Electrical Characteristics @ TA = 25 °C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 2) Drain-Source Breakdown Voltage BVDSS 50 75 ¾ V VGS = 0V, ID = 250 mA Zero Gate Voltage Drain Current IDSS ¾¾ 0.5 µA VDS = 50V, VGS = 0V Gate-Body Leakage IGSS ¾¾ ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 2) Gate Threshold Voltage VGS(th) 0.5 1.2 1.5 V VDS =VGS, ID =-250 mA Static Drain-Source On-Resistance RDS (ON) ¾ 1.4 3.5 W VGS = 10V, ID = 0.22A Forward Transconductance gFS 100 ¾¾ mS VDS =25V, ID = 0.2A, f = 1.0KHz DYNAMIC CHARACTERISTICS Input Capacitance Ciss ¾¾ 50 pF VDS = 10V, VGS = 0V f = 1.0MHz Output Capacitance Coss ¾¾ 25 pF Reverse Transfer Capacitance Crss ¾¾ 8.0 pF SWITCHING CHARACTERISTICS Turn-On Delay Time tD(ON) ¾¾ 20 ns VDD = 30V, ID = 0.2A, RGEN = 50 W Turn-Off Delay Time tD(OFF) ¾¾ 20 ns Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Short duration test pulse used to miminize self-heating effect. Source Gate Drain SOT-23 Dim Min Max A 0.37 0.51 B 1.20 1.40 C 2.30 2.50 D 0.89 1.03 E 0.45 0.60 G 1.78 2.05 H 2.80 3.00 J 0.013 0.10 K 0.903 1.10 L 0.45 0.61 M 0.085 0.180 a 0 ° 8 ° All Dimensions in mm |
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