THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information

Characteristic

Symbol

Test Conditions*

Value Units

Package Thermal Resistance

Package LH, 1-layer PCB with copper limited to solder pads

228

ºC/W

connected by thermal vias

110

ºC/W

Package UA, 1-layer PCB with copper limited to solder pads

165

ºC/W

*Additional thermal information available on Allegro Web site.

6

7

8

9

2

3

4

5

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

20

40

60

80

100

120

140

160

180

Temperature (ºC)

Power Derating Curve

LH, 1-layer PCB

LH, 2-layer PCB

UA, 1-layer PCB

0

100

200

300

400

500

600

700

800

900

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

20

40

60

80

100

120

140

160

180

Temperature (°C)

Power Dissipation versus Ambient Temperature

(R

ºC/W)

1-lay

er PC

B, Packa

ge

UA

(R

ºC/W

)

1-lay

er PCB,

Package

LH

(R

θJ

A

= 110

ºC/

W)

2-l

ayer

PCB,

Pa

ckag

e LH

Application Information

Chopper-Stabilized, Two Wire

Hall-Effect Latch

A1244

4

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com