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SIM3U167 Datasheet(PDF) 11 Page - Silicon Laboratories |
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SIM3U167 Datasheet(HTML) 11 Page - Silicon Laboratories |
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11 / 18 page ![]() SiM3U167-B-GDI Rev. 1.1 11 Table 3. Bond Pad Coordinates (Relative to Center of Die) Physical Pad Number Example Package Pin Number (TQFP-80) Package Pin Name Physical Pad X (µm) Physical Pad Y (µm) 1 1 PB4.5 1674 –1457 2 2 PB4.4 1674 –1224 3 3 PB4.3 1674 –990 4 4 VSSHD 1674 –826 5 5 VIOHD 1674 –721 6 6 PB4.2 1674 –554 7 7 PB4.1 1674 –321 8 8 PB4.0 1674 –87 9 33,75 GND 1760 113 10 NA Reserved* 1760 188 11 NA Reserved* 1760 263 12 NA Reserved* 1760 338 13 9 PB3.11 1760 754 14 10 PB3.10 1760 829 15 11 PB3.9 1760 904 16 12 PB3.8 1760 979 17 13 PB3.7 1760 1054 18 14 PB3.6 1760 1129 19 33,75 GND 1760 1212 20 15 PB3.5 1760 1294 21 16 PB3.4 1760 1369 22 17 PB3.3 1760 1444 23 18 PB3.2 1760 1519 24 19 PB3.1 1760 1594 25 20 PB3.0 1760 1669 26 21 PB2.14 1506 1836 *Note: Pins marked “Reserved” should not be connected. |
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