SiM3U167-B-GDI

14

Rev. 1.1

79

67

PB0.5

–789

–1835

80

68

PB0.4

–689

–1835

81

69

PB0.3

–589

–1835

82

70

PB0.2

–489

–1835

83

71

PB0.1

–389

–1835

84

72

PB0.0

–289

–1835

85

73

VIO

–68

–1836

86

74

VDD

–1

–1594

87

74

VDD

74

–1594

88

74

VDD

149

–1594

89

33,75

GND

252

–1594

90

33,75

GND

327

–1594

91

33,75

GND

402

–1594

92

76

VREGIN

607

–1828

93

77

VBUS

724

–1835

94

78

D+

880

–1830

95

79

D–

1190

–1830

96

80

/RESET

1347

–1835

97

33,75

GND

1439

–1835

Table 3. Bond Pad Coordinates (Relative to Center of Die) (Continued)

Physical Pad

Number

Example Package

Pin Number

(TQFP-80)

Package Pin Name

Physical Pad

X (µm)

Physical Pad

Y (µm)

*Note: Pins marked “Reserved” should not be connected.