SiM3U167-B-GDI

12

Rev. 1.1

27

22

PB2.13

1406

1836

28

23

PB2.12

1306

1836

29

24

PB2.11

1206

1836

30

25

PB2.10

1106

1836

31

26

PB2.9

1006

1836

32

27

PB2.8

906

1836

33

28

PB2.7

806

1836

34

29

PB2.6

706

1836

35

30

PB2.5

606

1836

36

31

PB2.4

506

1836

37

32

VIO

410

1836

38

33,75

GND

317

1836

39

33,75

GND

190

1836

40

34

PB2.3

–894

1836

41

35

PB2.2

–994

1836

42

36

PB2.1

–1094

1836

43

37

PB2.0

–1194

1836

44

38

PB1.15

–1294

1836

45

33,75

GND

–1390

1836

46

39

PB1.14

–1486

1836

47

40

PB1.13

–1586

1836

48

41

PB1.12

–1765

1657

49

42

PB1.11

–1765

1557

50

43

PB1.10

–1765

1457

51

44

SWDIO/TMS

–1765

1357

52

45

SWCLK/TCK

–1765

1257

Table 3. Bond Pad Coordinates (Relative to Center of Die) (Continued)

Physical Pad

Number

Example Package

Pin Number

(TQFP-80)

Package Pin Name

Physical Pad

X (µm)

Physical Pad

Y (µm)

*Note: Pins marked “Reserved” should not be connected.