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THS4521 Datasheet(PDF) 2 Page - Texas Instruments |
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THS4521 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 56 page  THS4531 SLOS358B – SEPTEMBER 2011 – REVISED MARCH 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGING/ORDERING INFORMATION(1) SPECIFIED CHANNEL PACKAGE- PACKAGE PACKAGE ORDERING TRANSPORT MEDIA, PRODUCT TEMPERATURE COUNT LEAD DESIGNATOR MARKING NUMBER QUANTITY RANGE 1 T4531 THS4531ID Rails, 75 SOIC-8 D –40°C to +125°C 1 T4531 THS4531IDR Tape and reel, 2500 1 4531 THS4531IDGK Rails, 80 THS4531 VSSOP-8 DGK –40°C to +125°C 1 4531 THS4531IDGKR Tape and reel, 2500 1 4531 THS4531IRUNT Tape and reel, 250 WQFN-10 RUN –40°C to +125°C 1 4531 THS4531IRUNR Tape and reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS VALUE UNITS Supply voltage, VS– to VS+ 5.5 Input/output voltage, VIN±, VOUT±, and VOCM pins (VS–) – 0.7 to (VS+) + 0.7 V Differential input voltage, VID 1 V Continuous output current, IO 50 mA Continuous input current, Ii 0.75 mA Continuous power dissipation See Thermal Information Maximum junction temperature, TJ 150 °C Operating free-air temperature range, TA –40 to +125 °C Storage temperature range, Tstg –65 to +150 °C Human body model (HBM) 3000 V Electrostatic discharge (ESD) Charge device model (CDM) 500 V ratings: Machine model (MM) 200 V THERMAL INFORMATION THS4531 THS4531 THS4531 VSSOP SOIC WQFN THERMAL METRIC(1) (MSOP) UNITS (P) (RUN) (DGK) 8 PINS 8 PINS 10 PINS θJA Junction-to-ambient thermal resistance 133 198 163 θJCtop Junction-to-case (top) thermal resistance 78 84 66 θJB Junction-to-board thermal resistance 73 120 113 °C/W ψJT Junction-to-top characterization parameter 26 19 17 ψJB Junction-to-board characterization parameter 73 118 113 θJCbot Junction-to-case (bottom) thermal resistance N/A N/A N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): THS4531 |
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