TPS23751

TPS23752

SLVSB97A – JULY 2012 – REVISED AUGUST 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

DEVICE

FEATURE

PACKAGE

MARKING

TPS23751

Standard

TSSOP-16 PowerPAD™

23751

–40°C to 85°C

TPS23752

Sleep Mode

TSSOP-20 PowerPAD™

TPS23752

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

VALUE

UNIT

–0.3 to 100

–0.6 to 100

–0.3 to 6.5

Voltage

–0.3 to 6.5

V

CS to ARTN

–0.3 to 18

Internally limited

LED

15

Current, sinking

mA

T2P, SRD

5

DEN

1

CLS

65

Current, sourcing

Internally limited

mA

Internally limited

Current, average sourcing or sinking

GATE

25

Human body model (HBM)

2

kV

ESD

Charged device model (CDM)

500

V

8/15

kV

Internally limited

°C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

ARTN must be connected to RTN.

(3)

(4)

Do not apply voltages to these pins.

(5)

SOA limited to RTN = 80 V at 1.2 A.

(6)

ESD per EN61000-4-2. A power supply containing the TPS23751 or TPS237512 was subjected to the highest test levels in the

standard. Refer to the ESD section.

2

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