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WDBR2 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers

Part # WDBR2
Description  Ultra Low Profile Power Resistors
PDF  4 Pages
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WDBR2 Datasheet(HTML) 1 Page - List of Unclassifed Manufacturers

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Ultra Low Profile
Power Resistors
WDBR Series
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
© TT electronics plc
2.14
· Ultra low profile thick-film on steel
· 500W to 7kW peak power
· Single fixing heatsink mountable
· Ideal for dynamic braking, inrush limit and
snubber circuits
· Choice of flying lead, push-on or solder terminations
· Low inductance design
· High isolation, even after failsafe overload fusing
· RoHS compliant, non-flammable construction
WDBR1/2
WDBR1
WDBR2
WDBR3
WDBR5
WDBR7
Resistance range
ohms
12, 15, 20, 22, 25,
47, 50, 100
12, 15, 20, 22, 25, 47, 50, 100, 150
Resistance tolerance
%
10
Pulse power rating 1
kW
0.5
1.5
2.0
3.5
5.0
7.0
Power rating on heatsink 2
W
160
180
200
260
270
280
Power rating on fan-cooled heatsink 3
W
300
700
780
900
1000
1490
TCR
ppm/°C
+500 to +600
Maximum element temperature
°C
365
Ambient temperature range (heatsink)
°C
-55 to +200
Dielectric withstand 4
V (dc/ac peak)
2500
Inductance (typical)
μH
<3
<4
<5
<6
Physical Data
Electrical Data
Dimensions in mm, weight without terminations in g
L ±0.1 W ±0.1 t ±0.1 ØD nom a nom b nom c nom Wt. nom
WDBR1/2
31.9
28.1
0.9
2.2
7.5
3.1
4.3
6.5
WDBR1
49.3
35.9
3.2
3.2
11.2
6.2
12.6
WDBR2
61
40.6
5.3
4.7
13.0
5.8
17.1
WDBR3
101.6
70
13.5
22.0
10.2
50.8
WDBR5
122
70
14.0
23.8
7.4
60.7
WDBR7
152.4
101.6
1.5
15.0
51.3
9.2
181.8
Notes:
1. For details of pulse condition see Fig. 1 in Performance Data.
2. Mounted on a 0.53°C/W heatsink with no forced air cooling, air temperature 25°C.
3. Mounted on a 0.53°C/W heatsink with 5m/s forced air cooling, air temperature 25°C.
4. Based on 100% production test, duration 2s minimum
Construction
A high integrity dielectric layer is applied to a machined
stainless steel substrate. Thick-film conductor and resistor
patterns are printed and fired, then protected with a high
temperature overglaze. The termination pads are tinned with
solder and optional terminals or leads are soldered on.
Fixing hole is located centrally except on WDBR1/2 where the dimension from
the edge by the terminations to the mounting hole centre is 16.68mm
W
L
c
b
a
Substratethickness =t
D


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