1

2

3

4

EN

SGND

SW

SW

VIND

VIND

5

PGND

NC

FB

VINC

6

7

8

9

10

8

7

6

5

DAP

2

3

4

7

9

8

VIND

EN

NC

DAP

SW

SW

SGND

6

10

1

5

FB

PGND

VINC

VIND

LM2833

VIND

SW

FB

SGND

L1

R1

D1

C1

VINC

PGND

C2

R2

EN

1

2

3

6

5

7,8

9,10

R3

C3

4

NC

LM2833

SNVS505D – MAY 2008 – REVISED JANUARY 2009

www.ti.com

Typical Application Circuit

Connection Diagrams

Figure 1. 10-Pin WSON

Figure 2. 10-pin MSOP-PowerPAD

See Package DSC

See Package DGQ

PIN DESCRIPTIONS

Pin(s)

Name

Description

1

VINC

Input supply for internal bias and control circuitry. Need to locally bypass this pin to GND.

Enable control input. Logic high enables operation. Do not allow this pin to float or subject to

2

EN

Signal (analog) ground. Place the bottom resistor of the feedback network as close as possible to

3

SGND

this pin for good load regulation.

4

NC

No user function, connect this pin to GND.

5

FB

Feedback pin. Connect this pin to the external resistor divider to set output voltage.

6

PGND

Power ground pin. Provides ground return path for the internal driver.

7, 8

SW

Switch pins. Connect these pins to the inductor and catch diode.

9, 10

VIND

Input supply voltage. Connect a bypass capacitor locally from these pins to PGND.

Connect to system ground for low thermal impedance, but it cannot be used as a primary GND

DAP

Die Attach Pad

connection.

2

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