MB88346LPFV datasheet(16/17 Pages) FUJITSU

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MB88346L

(Continued)

Please confirm the latest Package dimension by following URL.

http://edevice.fujitsu.com/fj/DATASHEET/ef-ovpklv.html

20-pin plastic SSOP

Lead pitch

0.65 mm

Package width

package length

4.40

× 6.50 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.45 mmMAX

Weight

0.09g

Code

(Reference)

P-SSOP20-4.4

×6.5-0.65

20-pin plastic SSOP

(FPT-20P-M03)

2003 FUJITSU LIMITED F20012S-c-4-6

6.50±0.10(.256±.004)

4.40±0.10

6.40±0.20

(.252±.008)

(.173±.004)

.049 –.004

+.008

–0.10

+0.20

1.25

(Mounting height)

0.10(.004)

0.65(.026)

0.24±0.08

(.009±.003)

110

"A"

0.10±0.10

(Stand off)

0.17±0.03

(.007±.001)

0.13(.005)

(.004±.004)

Details of "A" part

0~8˚

(.024±.006)

0.60±0.15

(.020±.008)

0.50±0.20

0.25(.010)

LEAD No.

INDEX

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).

Note 2) *2 : These dimensions do not include resin protrusion.

Note 3)Pins width and pins thickness include plating thickness.

Note 4) Pins width do not include tie bar cutting remainder.

MB88346LPFV Datasheet(PDF) 16 Page - fujitsu semiconductor

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