M24C08-RMC6TG datasheet(20/38 Pages) STMICROELECTRONICS

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Maximum rating

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Maximum rating

Stressing the device outside the ratings listed in Table 4 may cause permanent damage to

the device. These are stress ratings only, and operation of the device at these, or any other

conditions outside those indicated in the operating sections of this specification, is not

implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 4. Absolute maximum ratings

Symbol

Parameter

Min.

Max.

Unit

Ambient operating temperature

–40

130

°C

TSTG

Storage temperature

–65

150

°C

TLEAD

Lead temperature during soldering

see note(1)

1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb-free assembly), the ST ECOPACK®

7191395 specification, and the European directive on Restrictions of Hazardous Substances (RoHS

directive 2011/65/EU of July 2011).

°C

PDIP-specific lead temperature during soldering

260(2)

2. TLEAD max must not be applied for more than 10 s.

°C

IOL

DC output current (SDA = 0)

VIO

Input or output range

–0.50

6.5

VCC

Supply voltage

–0.50

6.5

VESD

Electrostatic pulse (Human Body model)(3)

3. Positive and negative pulses applied on different combinations of pin connections, according to AEC-

Q100-002 (compliant with JEDEC Std JESD22-A114, C1=100 pF, R1=1500

Ω).

3000(4)

4. 4000 V for devices identified by process letters S or G.

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