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M24C08-RMC6TG Datasheet(PDF) 35 Page - STMicroelectronics |
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M24C08-RMC6TG Datasheet(HTML) 35 Page - STMicroelectronics |
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35 / 38 page ![]() DocID023924 Rev 4 35/38 M24C08-W M24C08-R M24C08-F Package mechanical data 37 Figure 19. WLCSP 4-bump wafer-level chip-scale package recommended land pattern Table 22. M24C08-FCT6TP/T package data Symbol millimeters inches TYP MIN MAX TYP MIN MAX A 0.295 0.270 0.330 0.0116 0.0106 0.0130 A1 0.095 - - 0.0037 - - A2 0.200 - - 0.0079 - - Ø b 0.185 - - 0.0073 - - D 0.685 - 0.705 0.0270 - 0.0278 E 0.695 - 0.715 0.0274 - 0.0281 e 0.400 - - 0.0157 - - F 0.142 - - 0.0056 - - G 0.148 - - 0.0058 - - H 0.143 - - 0.0056 - - N4 aaaa 0.110 - - 0.0043 - - bbbb 0.110 - - 0.0043 - - cccc 0.110 - - 0.0043 - - dddd 0.060 - - 0.0024 - - eeee 0.060 - - 0.0024 - - |
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