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HT16270 Datasheet(PDF) 5 Page - Holtek Semiconductor Inc

Part # HT16270
Description  RAM Mapping 64 x16 LCD Controller for I/O C
PDF  17 Pages
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Manufacturer  HOLTEK [Holtek Semiconductor Inc]
Direct Link  http://www.holtek.com
Logo HOLTEK - Holtek Semiconductor Inc

HT16270 Datasheet(HTML) 5 Page - Holtek Semiconductor Inc

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Pad Description
Pad No.
Pad Name
I/O
Description
1
DATA
I/O Serial data input/output with pull-high resistor
2
VSS
¾ Negative power supply, ground
3
OSCI
I
Crystal oscillator input pin
4
OSCO
O Crystal oscillato output pin
5
VDD
¾ Positive power supply
6
VLCD
I
LCD operating voltage input pad.
7
IRQ
O Time base or watchdog timer overflow flag, NMOS open drain
output
8, 9
BZ, BZ
O 2kHz or 4kHz tone frequency output pair (Tristate output
buffer)
10~13
T1~T4
I
Not connected
14~29
COM0~COM15
O LCD common outputs
30~93
SEG0~SEG63
O LCD segment outputs
94
CS
I
Chip selection input with pull-high resistor. When the CS is
logic high, the data and command read from or write to the
HT16270 are disabled. The serial interface circuit is also reset.
But if the CS is at logic low level and is input to the CS pad, the
data and command transmission between the host controller
and the HT16270 are all enabled.
95
RD
I
READ clock input with pull-high resistor. Data in the RAM of
the HT16270 are clocked out on the rising edge of the RD sig-
nal. The clocked out data will appear on the data line. The host
controller can use the next falling edge to latch the clocked out
data.
96
WR
I
WRITE clock input with pull-high resistor. Data on the DATA
line are latched into the HT16270 on the rising edge of the WR
signal.
Absolute Maximum Ratings
Supply Voltage .............................-0.3V to 5.5V
Storage Temperature.................-50°Cto125°C
Input Voltage.................VSS-0.3V to VDD+0.3V
Operating Temperature ..............-25°Cto75°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
HT16270
5
April 21, 2000



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