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HCPL-3760 Datasheet(PDF) 4 Page - Agilent(Hewlett-Packard) |
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HCPL-3760 Datasheet(HTML) 4 Page - Agilent(Hewlett-Packard) |
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4 / 13 page ![]() 1-351 Maximum Solder Reflow Thermal Profile 240 ∆T = 115°C, 0.3°C/SEC 0 ∆T = 100°C, 1.5°C/SEC ∆T = 145°C, 1°C/SEC TIME – MINUTES 220 200 180 160 140 120 100 80 60 40 20 0 260 12 3 456789 10 11 12 (NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.) Regulatory Information The HCPL-3700/60 has been approved by the following organizations: UL Recognized under UL 1577, component recognition program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. |
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