1-352

Insulation and Safety Related Specifications

Parameter

Symbol Value Units

Conditions

Min. External Air Gap

L(IO1)

7.1

mm

Measured from input terminals to output terminals,

(External Clearance)

shortest distance through air

Min. External Tracking

L(IO2)

7.4

mm

Measured from input terminals to output terminals,

Path (External Creepage)

shortest distance path along body

Min. Internal Plastic

0.08

mm

Through insulation distance, conductor to conductor,

Gap (Internal Clearance)

usually the direct distance between the photoemitter

and photodetector inside the optocoupler cavity

Tracking Resistance

CTI

200

V

DIN IEC 112/VDE 0303 PART 1

(Comparative

Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 – surface mount classification is Class A in accordance with CECC 00802.

°C)

Parameter

Symbol

Min.

Max.

Units

Note

Storage Temperature

-55

125

°C

Operating Temperature

-40

85

°C

Lead Soldering Cycle

Temperature

260

°C1

Time

10

s

Input Current

Average

50

2

Surge

140

mA

2, 3

Transient

500

Input Voltage (Pins 2-3)

-0.5

V

Input Power Dissipation

230

mW

4

Total Package Power Dissipation

305

mW

5

Output Power Dissipation

210

mW

6

Output Current

Average

30

mA

7

Supply Voltage (Pins 8-5)

-0.5

20

V

Output Voltage (Pins 6-5)

-0.5

20

V

Solder Reflow Temperature Profile

See Package Outline Drawings section

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Note

Supply Voltage

218

V

Operating Temperature

070

°C

Operating Frequency

f

0

4

kHz

8