1-243

Figure 19. Amplitude Response vs.

Frequency.

Figure 20. 3 dB Bandwidth vs.

Temperature.

Figure 21. RMS Input-Referred Noise

vs. Recommended Application Circuit

Bandwidth.

f – FREQUENCY – kHz

0

5

-4

1

500

10

-2

-1

-3

50 100

VDD1 = 5 V

VDD2 = 5 V

TA = 25 °C

TA – TEMPERATURE – °C

260

-20

0

190

-40

100

20

230

250

210

40

60

80

240

220

200

VDD1 = 5 V

VDD2 = 5 V

Figure 16. Isolation Mode Rejection Test Circuit.

Figure 15. Output Supply Current vs.

Input Voltage.

VIN+ – INPUT VOLTAGE – V

12

-0.2

0

VDD1 = 5 V

VDD2 = 5 V

VIN– = 0 V

8

TA = 100°C

-0.4

0.4

0.2

TA = -40°C

10

TA = 25°C

11

9

Figure 17. Propagation Delay, Rise/Fall Time and Bandwidth Test Circuit.

Figure 18. Propagation Delays and

Rise/Fall Time vs. Temperature.

TA – TEMPERATURE – °C

3.0

-20

0

1.0

DELAY TO 90%

-40

100

20

RISE/FALL TIME

2.0

DELAY TO 50%

2.5

1.5

40

60

80

VIN– = 0 V

VIN+ = 0 TO 100 mV STEP

VDD1 = 5 V

VDD2 = 5 V

0.1 µF

VDD2

VOUT

8

7

6

1

3

HCPL-7820/7825

5

2

4

2 K

2 K

78L05

+15 V

0.1 µF

0.1 µF

-15 V

–

+

MC34081

75

pF

IN OUT

0.1

µF

0.1

µF

9 V

PULSE GEN.

VIM

+

–

10 K

10 K

75 pF

0.1 µF

VDD2

VOUT

8

7

6

1

3

HCPL-7820/7825

5

2

4

2 K

2 K

+15 V

0.1 µF

0.1 µF

-15 V

–

+

MC34081

0.1 µF

10 K

10 K

0.01 µF

VDD1

VIN

f – FREQUENCY – kHz

3.0

10

0

VIN+ = 200 mV

5

1000

50

VIN+ = 0 mV

1.5

VIN+ = 100 mV

2.5

0.5

100

500

VDD1 = 5 V

VDD2 = 5 V

VIN– = 0 V

TA = 25 °C

2.0

1.0