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GMS30C2116 Datasheet(PDF) 13 Page - Hynix Semiconductor |
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GMS30C2116 Datasheet(HTML) 13 Page - Hynix Semiconductor |
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13 / 322 page ![]() Overview 0-3 0.1. GMS30C2116/32 RISC/DSP (continued) On-chip Memory: ¡ Ü 4KByte internal (on-chip) memory Memory Data Types: ¡ Ü Unsigned and signed byte (8 bit) ¡ Ü Unsigned and signed half word (16 bit), located on half word boundary ¡ Ü Undedicated word (32 bit), located on word boundary ¡ Ü Undedicated double-word (64 bit), located on word boundary Runtime Stack: ¡ Ü Runtime stack is divided into memory part and register part ¡ Ü Register part is implemented by the 64 local registers holding the most recent stack frame(s) ¡ Ü Current stack frame (maximum 16 registers) is always kept in register part of the stack ¡ Ü Data transfer between memory and register part of the stack is automatic ¡ Ü Upper stack bound is guarded Instruction Cache: ¡ Ü An on-chip instruction cache reduces instruction memory access substantially Instructions General: ¡ Ü Variable-length instructions of one, two or three half words halve required memory bandwidth ¡ Ü Pipeline depth of only two stages, assures immediate refill after branches ¡ Ü Register instructions of type "source operator destination ⇒ destination" or "source operator immediate ⇒ destination" ¡ Ü All register bits participate in an operation ¡ Ü Immediate operands of 5, 16 and 32 bits, zero- or sign-expanded ¡ Ü Large address displacement of up to 28 bits ¡ Ü Two sets of signed arithmetical instructions: instructions set or clear either only the overflow flag or trap additionally to a Range Error routine on overflow ¡ Ü DSP instructions operate on 16-bit integer, real and complex fixed-point data and 32-bit integer data into 32-bit and 64-bit hardware accumulators Instruction Summary: ¡ Ü Memory instructions pipelined to a depth of two stages, trap on address register equal to zero (check for invalid pointers) |
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