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80C196MH Datasheet(PDF) 3 Page - Intel Corporation |
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80C196MH Datasheet(HTML) 3 Page - Intel Corporation |
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3 / 41 page ![]() 8XC196MH INDUSTRIAL MOTOR CONTROL CHMOS MICROCONTROLLER ® 3 PROCESS INFORMATION This device is manufactured on PX29.5, a CHMOS IV process. Additional process and reliability information is available in Intel’s Components Quality and Reliability Handbook (order number 210997). All thermal impedance data is approximate for static air conditions at 1 watt of power dissipation. Values will change depending on operating conditions and the application. The Intel Packaging Handbook (order number 240800) describes Intel’s thermal impedance test methodology. Table 1. Thermal Characteristics Package Type θJA θJC 84-lead PLCC 33°C/W 11°C/W 80-lead QFP 56°C/W 12°C/W 64-lead SDIP 56°C/W N/A Figure 2. The 8XC196MH Family Nomenclature X XX 8 X C 196 XX XX Device Speed: Product Family: No Mark = 16 MHz K x, Mx, Nx CHMOS Technology Program Memory Options: 0 = ROMless, 3 = ROM, 7 = OTPROM Package - Type Options: Temperature and Burn In Options: A2759-01 x = SDIP, x = PLCC, x = QFP x = –40˚C – +85˚C Ambient with Intel Standard Burn-In To address the fact that many of the package prefix variables have changed, all package prefix variables in this document are now indicated with an "x". NOTE: |
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