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µPC1862

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales

offices.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Surface Mount Device

µPC1862GS: 36-pin plastic shrink SOP (300 mil)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 235

°C or below (Package surface temperature),

IR35-00-2

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 2 times.

VPS

Peak temperature: 215

°C or below (Package surface temperature),

VP15-00-2

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 2 times.

Wave Soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

WS60-00-1

Maximum number of flow process: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

Partial heating method

Pin temperature: 300

°C or below,

–

Heat time: 3 seconds or less (Per each side of the device).

Caution

Apply only one kind of soldering condition to a device, except for “Partial heating method”, or the

device will be damaged by heat stress.