Preliminary Technical Data

ADN2849

Rev. Pr. G | Page 13 of 17

POWER DISSIPATION

For improved heat dissipation the module’s case can be used as

heat sink as shown in figure 29. A compact optical module is a

complex thermal environment, and calculations of device

The power dissipated by the ADN2849 is a function of the

supply voltage and the level of bias offset and modulation

voltages required. Figure 28 shows the power dissipation of the

ADN2849 vs. modulation voltage for different bias offset

voltages. To ensure long-term reliable operation, the junction

ALL CAPS (Initial cap)

000

000

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000

000

000

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TBD

Figure 28. Power dissipation of the ADN2849 vs. bias offset and modulation voltage

T

TOP

T

J

T

PAD

Die

Package

Thermal Compound

Module Case

PCB

Filled Vias

Copper Plane

Thermo-couple

Figure 29. Typical optical module structure