µPD16804

9

RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the conditions described below.

For soldering methods and conditions other than those listed below, consult NEC.

Surface mount type

For the details of the recommended soldering conditions of this type, refer to Semiconductor Device Mounting

Technology Manual (C10535E).

µPD16804GS

Symbol of

Soldering Method

Soldering Conditions

Recommended

Soldering

Infrared reflow

Peak package temperature: 235

°C, Time: 30 seconds MAX. (210 °C MIN.),

IR35-00-2

Number of times: 2 MAX.

VPS

Peak package temperature: 215

°C, Time: 40 seconds MAX. (200 °C MIN.),

VP15-00-2

Number of times: 2 MAX.

Wave soldering

Soldering bath temperature: 260

°C Time: 10 seconds MAX.,

WS60-00-1

Preheating temperature: 120

°C MAX. (package surface temperature),

Number of times: 1

Note The number of storage days at 25

°C, 65% RH after the dry pack has been opened

Caution Do not use two or more soldering methods in combination (except pin partial heating).