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AN1596 Datasheet(PDF) 7 Page - STMicroelectronics |
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AN1596 Datasheet(HTML) 7 Page - STMicroelectronics |
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7 / 24 page ![]() 7/24 AN1596 - APPLICATION NOTE Under and over voltage lockout Under and overvoltage protections occur when the supply voltage drops or raises to minimum and maximum levels specified in the datasheet as VUSD and VOV. Under VUSD=5.5V value the PowerMOS simply turns off, just because it would not work properly. The undervoltage condition may occur when turning on a car headlamp for example, which is a near short circuit. The inductive effect of wires (typically 1µH/m) generates an opposing voltage across the wire and the apparent supply voltage drops. The current increase rate for an HSD is about 1A/ms for a short-circuited load and using a 5m length wire, the induced voltage will not be large enough to reduce the supply voltage below 5.5V and - therefore - the HSD switches on. The overvoltage control circuit acts as a protection for the load against overvoltages (VOV=36V and above that value the device switches off). Reverse battery protection Most auto manufacturers specify that any electronic device must be able to withstand a reverse battery connection. The exact magnitude of the reverse voltage requirement varies per manufacturer, but the worst case seems to be -24V for 10 min. The maximum allowed value of the ground current during reverse battery is -IGND and it is specified in the device's datasheet. There are two possible solutions to this problem. Solution 1: Resistor in the ground line (RGND only). This can be used with any kind of load. The following is an indication on how to dimension the RGND resistor. Power dissipation in RGND during reverse battery situation is the following: This resistor can be shared amongst several different HSDs. In this case in the formula (1) IS(on)max becomes the sum of the maximum on-state currents of the different devices. When the microprocessor ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several HSDs sharing the same RGND. This can lead to a very little value of RGND to comply with formula (1) and formula (2) may not be fulfilled. To overcome this problem, ST suggests the following solution. Solution 2: a diode (DGND) in the ground line. A resistor (RGND=1kΩ) should be inserted in parallel to DGND if the device drives an inductive load (see chapter about fast demagnetization). This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift (~ 600mV) in the input threshold and in the status output values if the microcontroller ground is not common to the device ground. This shift will not vary if more than one HSD share the same diode/resistor network. Micro-controller I/Os protection If a ground protection network is used and negative transients are present on the VCC line, the HSD control pins will be pulled negative due to parasitic internal structures. This may cause the microcontroller I/O pins to latch up. The value of the resistors (Rprot) to be connected, is a compromise between the voltage shift from the micro-controller output to the HSD control pins, and the latch-up limit current of micro-controller I/Os. The following condition must be fulfilled: Where: -Vccpeak=negative peak voltage max ) ( 600 on S GND I mV R ≤ (1) (2) GND CC GND I V R − − ≥ () GND CC D R V P 2 − = IN GND IH C out prot lu CCpeak I V V V R I V − − ≤ ≤ − µ |
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