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AN1596 Datasheet(PDF) 7 Page - STMicroelectronics

Part # AN1596
Description  Today?셲 automotive market requires a continuous increasing
PDF  24 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN1596 Datasheet(HTML) 7 Page - STMicroelectronics

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AN1596 - APPLICATION NOTE
Under and over voltage lockout
Under and overvoltage protections occur when the supply voltage drops or raises to minimum and
maximum levels specified in the datasheet as VUSD and VOV. Under VUSD=5.5V value the PowerMOS
simply turns off, just because it would not work properly. The undervoltage condition may occur when
turning on a car headlamp for example, which is a near short circuit. The inductive effect of wires (typically
1µH/m) generates an opposing voltage across the wire and the apparent supply voltage drops. The
current increase rate for an HSD is about 1A/ms for a short-circuited load and using a 5m length wire, the
induced voltage will not be large enough to reduce the supply voltage below 5.5V and - therefore - the
HSD switches on. The overvoltage control circuit acts as a protection for the load against overvoltages
(VOV=36V and above that value the device switches off).
Reverse battery protection
Most auto manufacturers specify that any electronic device must be able to withstand a reverse battery
connection. The exact magnitude of the reverse voltage requirement varies per manufacturer, but the
worst case seems to be -24V for 10 min. The maximum allowed value of the ground current during reverse
battery is -IGND and it is specified in the device's datasheet. There are two possible solutions to this
problem.
Solution 1: Resistor in the ground line (RGND only). This can be used with any kind of load. The following
is an indication on how to dimension the RGND resistor.
Power dissipation in RGND during reverse battery situation is the following:
This resistor can be shared amongst several different HSDs. In this case in the formula (1) IS(on)max
becomes the sum of the maximum on-state currents of the different devices. When the microprocessor
ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the
input thresholds and the status output values. This shift will vary depending on how many devices are ON
in the case of several HSDs sharing the same RGND. This can lead to a very little value of RGND to comply
with formula (1) and formula (2) may not be fulfilled. To overcome this problem, ST suggests the following
solution.
Solution 2: a diode (DGND) in the ground line. A resistor (RGND=1kΩ) should be inserted in parallel to
DGND if the device drives an inductive load (see chapter about fast demagnetization). This small signal
diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground
network will produce a shift (~ 600mV) in the input threshold and in the status output values if the
microcontroller ground is not common to the device ground. This shift will not vary if more than one HSD
share the same diode/resistor network.
Micro-controller I/Os protection
If a ground protection network is used and negative transients are present on the VCC line, the HSD
control pins will be pulled negative due to parasitic internal structures. This may cause the microcontroller
I/O pins to latch up. The value of the resistors (Rprot) to be connected, is a compromise between the
voltage shift from the micro-controller output to the HSD control pins, and the latch-up limit current of
micro-controller I/Os. The following condition must be fulfilled:
Where:
-Vccpeak=negative peak voltage
max
)
(
600
on
S
GND
I
mV
R
≤
(1)
(2)
GND
CC
GND
I
V
R
−
−
≥
()
GND
CC
D
R
V
P
2
−
=
IN
GND
IH
C
out
prot
lu
CCpeak
I
V
V
V
R
I
V
−
−
≤
≤
−
µ



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