9

µPD16901

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended below.

For soldering methods and conditions other than those recommended, please contact your NEC sales representative.

For details of recommended soldering conditions, refer to the information document "Semiconductor Device

Mounting Technology Manual."

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235 ˚C; Duration: 30 sec. max. (210 ˚C or above):

IR35-00-3

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)

is recommended.

VPS

Package peak temperature: 215 ˚C; Duration: 40 sec. max. (200 ˚C or above):

VP15-00-1

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)

is recommended.

Wave soldering

Package peak temperature: 260 ˚C or less, Duration: 10 sec. max.,

WS60-00-1

Preparatory heating temperature: 120 ˚C or less; Number of times: 1

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)

is recommended.

Note For the storage period after unpacking from the dry-pack, storage conditions are max. 25 ˚C, 65% RH.

Caution Use of more than one soldering method should be avoided.

REFERENCE DOCUMENTS

NEC Semiconductor Device Reliability/Quality Control System

10983E

Semiconductor Device Quality Guarantee Guide

MEI-1202

Semiconductor Device Mounting Technology Manual

C10535E