TGS2353

DC – 18 GHz High Power SPDT Switch

Product Compliance Information

ESD Information

ESD Rating:

TBD

Value:

Passes

≥ TBD V min.

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

Solderability

This part is compliant with EU 2002/95/EC RoHS

directive (Restrictions on the Use of Certain Hazardous

Substances in Electrical and Electronic Equipment).

This product also has the following attributes:

• Lead Free

• Halogen Free (Chlorine, Bromine)

• Antimony Free

• PFOS Free

• SVHC Free

ECCN

US Department of Commerce EAR99

Assembly Notes

Component placement and adhesive attachment assembly notes:

•

Vacuum pencils and/or vacuum collets are the preferred method of pick up.

•

Air bridges must be avoided during placement.

•

The force impact is critical during auto placement.

•

Organic attachment (i.e. epoxy) can be used in low-power applications.

•

Curing should be done in a convection oven; proper exhaust is a safety concern.

Reflow process assembly notes:

•

Use AuSn (80/20) solder and limit exposure to temperatures above 300

°C to 3-4 minutes, maximum.

•

An alloy station or conveyor furnace with reducing atmosphere should be used.

•

Do not use any kind of flux.

•

Coefficient of thermal expansion matching is critical for long-term reliability.

•

Devices must be stored in a dry nitrogen atmosphere.

Interconnect process assembly notes:

•

Thermosonic ball bonding is the preferred interconnect technique.

•

Force, time, and ultrasonics are critical parameters.

•

Aluminum wire should not be used.

•

Devices with small pad sizes should be bonded with 0.0007-inch wire.

Preliminary Data Sheet: Rev A 06/20/11

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Disclaimer: Subject to change without notice

© 2011 TriQuint Semiconductor, Inc.