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AN1902 - APPLICATION NOTE

2. PACKAGES

The VK06 is assembled in two different packages in order to cover both the surface mounting and the

through-hole PCB. The packages are the SO-16 narrow and the SIP-9 (see figure 6).

Figure 6: Package outline and pin configuration

In figure 7 the SO-16 thermal characterization is reported. In this package eight pins are connected to the

tab to reduce the junction-pin thermal resistance whereas the case-ambient thermal resistance is related

to the copper area on the PCB (device heat-sink). The device has been characterized at three different

the devices case temperatures.

SO16 PACKAGE

SIP9 PACKAGE

N° pin

Name

N° pin

Name

1

CAP1

1

CAP1

2

CapPREH

2

CapPREH

3

GND

3

GND

4DIAC

4

DIAC

5

SEC

5

COLL.

6SEC

7CAP2

7

8

CapEOL

8

CAP2

9÷16

COLL

9

CapEOL

1

8

9

16

1

9

Rth case-ambient

50

60

70

80

90

100

110

120

130

140

150

160

0

0.5

1

1.5

2

Cm

2

°C/W

1W

0.5W

0.25W