LT1027

7

sn1027 1027fcs

0.050

(1.270)

MAX

0.016 – 0.021**

(0.406 – 0.533)

0.010 – 0.045*

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.230

(5.842)

TYP

0.027 – 0.045

(0.686 – 1.143)

0.028 – 0.034

(0.711 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

45

°TYP

H8 (TO-5) 0.230 PCD 1197

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND 0.045" BELOW THE REFERENCE PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

0.016 – 0.024

(0.406 – 0.610)

*

**

PIN 1

PACKAGE DESCRIPTIO

H Package

8-Lead TO-5 Metal Can (.230 Inch PCD)

(Reference LTC DWG # 05-08-1321)

OBSOLETE PACKAGE

SCHE

T

EQUIVALE

ATIC

OUTPUT CURRENT LIMIT AND

BIAS CIRCUITS NOT SHOWN

NR

GND

1027 ES

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.