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AN4337 Datasheet(PDF) 8 Page - STMicroelectronics |
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AN4337 Datasheet(HTML) 8 Page - STMicroelectronics |
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8 / 14 page ![]() IAR and EAS electrical thermal approach AN4337 8/14 DocID025012 Rev 1 Figure 4. Zthj-c thermal impedance The temperature increase due to avalanche and the final junction temperature is: Equation 7 Equation 8 In these working conditions, the MOSFET device (as Table 1 and 2) is safe since the final junction temperature and the maximum avalanche energy are much lower than data specifications. At this point we can calculate the repetitive avalanche energy pulses in order to understand how many pulses are necessary to raise the junction temperature from an initial 25 °C to the maximum specification (Tj=150 °C). From the following equation: Equation 9 We have: Equation 10 Since the ∆t duration of a single pulse is very short, we have: Equation 11 Hence, for a period T=20 µs, using Equation 5 we obtain: C t E Zth T avalanche c j c j ° = ∆ ⋅ = ∆ − − 7 . 8 2 C T T c j ° = + = 7 . 33 7 . 8 )) ( ) 1 ( ) ( ( 2 (max) t Zth T t Zth T t t E T a j a j avalanche a j ∆ ∆ − + ∆ ∆ = ∆ − − − τ avalanche avalanche a j a j a j E t E t Zth T t T T Zth 2 2 ) ( ) 1 ( ) ( (max) ∆ ⋅ ∆ ∆ − − ∆ = − − − τ W C t Zth t Zth c j a j / 05 . 0 ) ( ) ( ° = ∆ = ∆ − − |
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