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AN4337 Datasheet(PDF) 8 Page - STMicroelectronics

Part # AN4337
Description  power MOSFETs are considered rugged with respect to the avalanche
PDF  14 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN4337 Datasheet(HTML) 8 Page - STMicroelectronics

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IAR and EAS electrical thermal approach
AN4337
8/14
DocID025012 Rev 1
Figure 4. Zthj-c thermal impedance
The temperature increase due to avalanche and the final junction temperature is:
Equation 7
Equation 8
In these working conditions, the MOSFET device (as Table 1 and 2) is safe since the final
junction temperature and the maximum avalanche energy are much lower than data
specifications.
At this point we can calculate the repetitive avalanche energy pulses in order to understand
how many pulses are necessary to raise the junction temperature from an initial 25 °C to the
maximum specification (Tj=150 °C).
From the following equation:
Equation 9
We have:
Equation 10
Since the ∆t duration of a single pulse is very short, we have:
Equation 11
Hence, for a period T=20 µs, using Equation 5 we obtain:
C
t
E
Zth
T
avalanche
c
j
c
j
°
=
∆
⋅
=
∆
−
−
7
.
8
2
C
T
T
c
j
°
=
+
=
7
.
33
7
.
8
))
(
)
1
(
)
(
(
2
(max)
t
Zth
T
t
Zth
T
t
t
E
T
a
j
a
j
avalanche
a
j
∆
∆
−
+
∆
∆
=
∆
−
−
−
τ
avalanche
avalanche
a
j
a
j
a
j
E
t
E
t
Zth
T
t
T
T
Zth
2
2
)
(
)
1
(
)
(
(max)


∆
⋅
∆
∆
−
−
∆
=
−
−
− τ
W
C
t
Zth
t
Zth
c
j
a
j
/
05
.
0
)
(
)
(
°
=
∆
=
∆
−
−



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