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AN533 Datasheet(PDF) 12 Page - STMicroelectronics |
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AN533 Datasheet(HTML) 12 Page - STMicroelectronics |
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12 / 22 page ![]() Through-hole packages AN533 12/22 With rivets: Pop rivets should never be used for the following reasons: ● A too rigorous expansion of the metal can lead to a distortion of the heatsink hole and induce mechanical stresses on the die. ● High crimping shock can damage the die. Press rivets can be used with caution provided they are of a soft metal like aluminium. The crimping force must be applied slowly and carefully in order to avoid shock and deformation of the heatsink. Figure 10. Assembly with rivet With clips: Care should be taken with the contact area between the plastic case and the clip: the maximum pressure allowed on plastic is 150 N/mm2. Over this value, cracks may be induced in the package. Therefore, the clips have to be round or smooth in the contact area to avoid concentrated loads on the plastic body. The force applied on the component depends on the heatsink and the component thickness, so they must be specially designed to take this value into account. Screw assembly is preferred to clip assembly for insulated packages. Figure 11. Clip assembly Rivet Contact grease Component Heatsink Contact grease d Component Clip Heatsink |
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