AN533

Through-hole packages

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1.6

Through-hole package wave soldering

The lead-free through-hole devices may be soldered with lead-free solder pastes or alloys

(Sn-Ag-Cu based alloys). The typical soldering temperature is 260 °C.

Alternatively these devices may be soldered with SnPb based solder pastes. The soldering

temperature is then typically around 220 °C.

Interface adherences on through-hole package structures are qualified to sustain only 3

consecutive dips of their connections in a solder pot at 260 °C (-0 °C / +5 °C) .

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immersion duration: 10 seconds each

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delay between 2 dippings: 5 minutes

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minimum distance solder to package plastic body: according to packages, by default

1mm

Lead-free devices are described in an internal specification defining:

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their characteristics: lead-free connection coating, solderability and identification

features

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their reliability such as soldering resistance, reliability performances, whiskers risk

prevention.

Components Definition & Characteristics). Please consult that document for further

information.

ECOPACK is a registered trademark of STMicroelectronics