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AN2639 Datasheet(PDF) 14 Page - STMicroelectronics |
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AN2639 Datasheet(HTML) 14 Page - STMicroelectronics |
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14 / 15 page ![]() Revision history AN2639 14/15 DocID14016 Rev 4 7 Revision history Table 5. Document revision history Date Revision Changes 16-Oct-2007 1 Initial release 26-May-2009 2 Modified tL and tP in Table 3: JEDEC standard Lead-free reflow profile (according to J-STD-020D). Updated Figure 6: Recommended flow to control package moisture absorption. 22-May-2013 3 Updated Table 1: Microcontroller package types and Table 2: Package/soldering process compatibility. Added UFQFPN and WLCSP packages in Section 6: Dry packing. Document converted to new template and disclaimer updated. 07-Jul-2014 4 Updated RoHS directive and related note in Section 1: Lead- free packages at STMicroelectronics. |
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