AN2657

Model description and parameter extraction

11/18

Figure 4.

Generic internal RF package structure

Figure 5.

PowerFLAT cross-section

The molding resin has a dielectric constant equal to 4 and a dielectric loss tangent of 0.005.

The leads of the package are made of copper, while the bonding wires are made of gold.

During the simulation, the device contact pads and the paddle are considered as a PEC

(perfect electric conductive surface lossless). Instead, along the external sides of the air box

containing the package, an electric and magnetic field total wave absorption condition was

set to consider the radiation losses (Equation 30).

Equation 30

During the simulation lumped ports were used to excite the fields (Figure 6) [7]. The

package simulation performed was in the frequency range from 1 MHz to 50 GHz.

∇ E

×

()

tan

jk

0

j

k

0

-----

∇

tan

∇

tan

E

tan

×

()

×

j

k

0

-----

∇

tan

∇

tan

E

tan

⋅

()

×

⋅

+

⋅

–

⋅

=