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LTC3230 Datasheet(PDF) 13 Page - Linear Technology |
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LTC3230 Datasheet(HTML) 13 Page - Linear Technology |
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13 / 16 page ![]() LTC3230 13 3230fa APPLICATIONS INFORMATION of capacitor is needed to ensure minimum capacitances at all temperatures and voltages. Table 3 shows a list of ceramic capacitor manufacturers and how to contact them. Table 3. Recommended Capacitor Vendors AVX xww.avxcrp.com Kemet www.kemet.com Murata www.murata.com Taiyo Yuden www.t-yuden.com Vishay www.vishay.com Layout Considerations and Noise Due to the high switching frequency and the transient currents produced by the LTC3230, careful board layout is necessary. A true ground plane and short connections to all capacitors will improve performance and ensure proper regulation under all conditions. The flying capacitor pins C1P, C2P, C1M and C2M will have high edge rate waveforms. The large dv/dt on these pins can couple energy to adjacent PCB runs. Magnetic fields can also be generated if the flying capacitors are not close to the LTC3230 (i.e., the loop area is large). To decouple capacitive energy transfer, a grounded PCB trace between the sensitive node and the LTC3230 pins will shield the sensitive node. For a high quality AC ground, the shield trace should be returned to a solid ground plane that extends all the way to the LTC3230. The following guidelines should be followed when design- ing a PCB layout for the LTC3230: • The Exposed Pad should be soldered to a large cop- per plane that is connected to a solid, low impedance ground plane using plated through hole vias for proper heat sinking and noise protection. • Input and output capacitors must be placed close to the part. • The flying capacitors must be placed close to the part. The traces from the pins to the capacitor pad should be as wide as possible. • VINandCPOtracesmustbewidetominimizeinductance and handle high currents. • LED pads must be large and connected to the other layers of metal to ensure proper heat sinking. • The RSET pin is sensitive to noise and capacitance. The resistor should be placed near the part with minimum line width. Power Efficiency To calculate the power efficiency ( η) of a white LED driver chip, the LED power should be compared to the input power. The difference between these two numbers represents lost power whether it is in the charge pump or the current sources. Stated mathematically, the power efficiency is given by: η= P P LED IN The efficiency of the LTC3230 depends upon the mode in which it is operating. Recall that the LTC3230 operates as a pass switch, connecting VIN to CPO, until dropout is detected at a LED pin. This feature provides the optimum efficiency available for a given input voltage and LED forward voltage. When it is operating as a switch, the efficiency is approximated by: η= = = P P VI VI V V LED IN LED LED IN IN LED IN • • since the input current will be very close to the sum of the LED currents. At moderate to high output power, the quiescent current of the LTC3230 is negligible and the expression above is valid. Once dropout is detected at any LED pin, the LTC3230 enables the charge pump in 1.5x mode. In 1.5x boost mode, the efficiency is similar to that of a linear regulator with an effective input voltage of 1.5 times the actual input voltage. This is because the input current for a 1.5x charge pump is approximately 1.5 times the load current. In an ideal 1.5x charge pump, the power efficiency would be given by: η= = = P P VI VI V V LED IN LED LED IN IN LED IN • •. • . • 15 15 |
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