RT8511B datasheet(4/11 Pages) RICHTEK

4 / 11 page

RT8511B

DS8511B-05

February 2015

www.richtek.com

is a registered trademark of Richtek Technology Corporation.

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

VIN Quiescent Current

VFB = 1.5V, No Switching

725

A

IQ_SW

VFB = 0V, Switching

2.2

VIN Shutdown Current

ISHDN

VIN = 4.5V, VEN = 0V

A

Control Input

EN, PWM

Threshold Voltage

Logic-High

VIH

VIN = 2.7V to 24V

1.6

Logic-Low

VIL

VIN = 2.7V to 24V

0.8

EN Sink Current

IIH

VEN = 3V

A

Shutdown Delay

tSHDN

EN high to low

PWM Dimming Frequency

0.1

kHz

Boost Converter

Switching Frequency

fOSC

VIN = 2.7V to 24V

0.4

0.5

0.6

MHz

LX On Resistance

(N-MOSFET)

RDS(ON)

VIN > 5V

0.4

0.6



Minimum ON Time

Maximum Duty Cycle

DMAX

VFB = 0V, Switching

(VIN = 4.5V, TA = 25

°C, unless otherwise specified)

Electrical Characteristics

Recommended Operating Conditions

(Note 4)



Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------ 2.7V to 24V



Junction Temperature Range --------------------------------------------------------------------------------------------

−40°C to 125°C



Ambient Temperature Range --------------------------------------------------------------------------------------------

−40°C to 85°C

Absolute Maximum Ratings

(Note 1)



VIN, EN, PWM, DIMC to GND ------------------------------------------------------------------------------------------

−0.3V to 26.5V



FB, OVP to GND ----------------------------------------------------------------------------------------------------------

−0.3V to 48V



LX to GND ------------------------------------------------------------------------------------------------------------------

−0.3V to 48V

< 500ns ----------------------------------------------------------------------------------------------------------------------

−1V to 48V



Power Dissipation, PD @ TA = 25

°C

WDFN-8L 2x2 -------------------------------------------------------------------------------------------------------------- 0.833W



Package Thermal Resistance (Note 2)

WDFN-8L 2x2,

θJA --------------------------------------------------------------------------------------------------------- 120°C/W

WDFN-8L 2x2,

θJC--------------------------------------------------------------------------------------------------------- 8.2°C/W



Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260

°C



Junction Temperature ----------------------------------------------------------------------------------------------------- 150

°C



Storage Temperature Range --------------------------------------------------------------------------------------------

–65°C to 150°C



ESD Susceptibility (Note 3)

HBM (Human Body Model) ---------------------------------------------------------------------------------------------- 2kV

MM (Machine Model) ----------------------------------------------------------------------------------------------------- 200V

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