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DS111011

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

SGL0163Z

SOT-363 PCB Pad Layout

SOT-363 Nominal Package Dimensions

Dimensions in inches (millimeters)

Refer to drawing posted at www.rfmd.com for tolerances.

Pin Names and Description

Pin

Function

Description

1NC

No Electrical Connection. Provide an isolated (ungrounded) solder pad for mounting integrity.

2GND

Connection to Ground. Provide via holes as close to the device ground leads as possible to reduce ground inductance

and achieve optimum RF performance.

3RF IN

RF Input Pin. This pin requires the use of an external DC blocking capacitor chosen for the frequency of operation.

4DC BIAS

Voltage Supply Connection. Bypass with suitable capacitors.

5GND

Connection to Ground. Provide via holes as close to the device ground leads as possible to reduce ground inductance

and achieve optimum RF performance.

6RF OUT/

BIAS

RF Output and Voltage Supply. DC voltage is present on this pin, therefore a DC blocking capacitor is necessary for

proper operation.

0.026

0.075

0.016

0.035

Pad Layout

Notes:

1. Provide a ground pad area under device pins 2 & 5

with plated via holes to the PCB ground plane.

2. We recommend 1 or 2 ounce copper. Measure-

ments for this data sheet were made on a 31 mil

thick Getek with 1 ounce copper on both sides.