IR3531A_15 datasheet(35/39 Pages) IRF

35 / 39 page

4+1 Phase Dual Output Control IC

IR3531A

March 22, 2012 | FINAL | V1.11

METAL AND COMPONENT PLACEMENT

 Lead land width should be equal to nominal part

lead width. The minimum lead to lead spacing

should be ≥ 0.2mm to minimize prevent shorting.

 Lead land length should be equal to maximum

part lead length + 0.3 mm outboard extension +

0.05mm inboard extension. The outboard

extension ensures a large and inspectable toe fillet,

and the inboard extension will accommodate any

part misalignment and ensure a fillet.

 Center pad land length and width should be

equal to maximum part pad length and width.

However, the minimum metal to metal spacing

should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for

1 oz. Copper and ≥ 0.23mm for 3 oz. Copper)

 A single 0.30mm diameter via shall be placed in the

center of the pad land and connected to ground to

minimize the noise effect on the IC.

 No PCB traces should routed nor Vias placed under

any of the 4 corners of the IC package. Doing so

can cause the IC to rise up from the PCB resulting

in poor solder joints to the IC leads.

Figure 19: Metal and Component Placement

* Contact International Rectifier to receive an electronic PCB Library file in your preferred format.

IR3531A Datasheet(PDF) 35 Page - International Rectifier