12-Bit + Sign Digital Temperature Sensors

with Serial Interface

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

All Voltages Referenced to GND

SO .......................................................................-1mA to +50mA

Current into Any Pin ............................................................10mA

6-Pin SOT23 (derate 9.10mW/°C above +70°C)..........727mW

Junction Temperature ......................................................+150°C

Operating Temperature Range (Note 1) ...........-55°C to +150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature .............................................................Note 2

ELECTRICAL CHARACTERISTICS

and 4)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

TEMPERATURE

-0.8

±0.2

+0.8

0°C

-1.0

±0.2

+1.0

-20°C

-1.6

+0.3

+1.6

-20°C

-2.3

+0.5

+2.3

°C

-40°C

-3.2

+0.8

+3.2

-1.0

+1.5

+3.5

Accuracy

-5.0

+1.5

+6.5

Power-Supply Sensitivity

PSS

0.2

0.6

°C/V

Resolution

0.0625

°C

MAX6629, MAX6630,

CS high

0.37

0.5

0.65

Time Between Conversion Starts

MAX6631, MAX6632,

CS high

5.9

8

10.5

s

Conversion Time

180

250

320

ms

POWER SUPPLY

Supply Voltage Range

3.0

5.5

V

5

ADC idle (Figure 2),

CS = low

6

20

Supply Current, SCK Idle

ADC converting (Figure 2)

360

650

µA

MAX6629, MAX6630

200

400

Average Operating Current

MAX6631, MAX6632

32

50

µA

Power-On Reset (POR)

Threshold

1.6

V

Note 1: It is not recommended to operate the device above +125°C for extended periods of time.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles

recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection

Reflow. Preheating is required. Hand or wave soldering is not allowed.