April 1998•

4-93

MIC4574

Micrel

4

Ordering Information

Part Number

Voltage

Temperature Range

Package

MIC4574-3.3BN

3.3V

–40

°C to +85°C

8-pin DIP

MIC4574-5.0BN

5.0V

–40

°C to +85°C

8-pin DIP

MIC4574BN

Adjustable

–40

°C to +85°C

8-pin DIP

MIC4574-3.3BWM

3.3V

–40

°C to +85°C

14-lead SOIC

MIC4574-5.0BWM

5.0V

–40

°C to +85°C

14-lead SOIC

MIC4574BWM

Adjustable

–40

°C to +85°C

14-lead SOIC

Pin Configuration

1

2

3

4

8

7

6

5

FB

SGND

SHDN

PGND

NC

SW

NC

8-Pin DIP (N)

14-Lead Wide SOIC (WM)

2

NC

NC

13

3

FB

SW

12

4

SGND

NC

11

5

SHDN

10

6

PGND

NC

9

7

NC

NC

8

1

NC

NC

14

Pin Description

Pin Number

Pin Number

Pin Name

Pin Function

N Package

WM Package

1

NC

Not internally connected. Solder to printed circuit for maximum heat transfer.

2

NC

Not internally connected. Solder to printed circuit for maximum heat transfer.

1

3

FB

Feedback (Input): Output voltage feedback to regulator. Connect to output of

supply for fixed versions. Connect to 1.23V tap of resistive divider for

adjustable versions.

2

4

SGND

Signal Ground

3

5

SHDN

Shutdown (Input): Logic low enables regulator. Logic high (> 2.4V) shuts

down regulator.

4

6

PGND

Power Ground

7

NC

Not internally connected. Solder to printed circuit for maximum heat transfer.

8

NC

Not internally connected. Solder to printed circuit for maximum heat transfer.

9

NC

Not internally connected. Solder to printed circuit for maximum heat transfer.

510

V

IN

Supply Voltage (Input): Unregulated +4V to +24V supply voltage.

11

NC

Not internally connected. Solder to printed circuit for maximum heat transfer.

7

12

SW

Switch (Output): Emitter of NPN output switch. Connect to external storage

inductor and Shottky diode.

8

13

NC

Not internally connected. Solder to printed circuit for maximum heat transfer.

14

NC

Not internally connected. Solder to printed circuit for maximum heat transfer.