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MIC5231 Datasheet(PDF) 5 Page - Micrel Semiconductor |
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MIC5231 Datasheet(HTML) 5 Page - Micrel Semiconductor |
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5 / 8 page ![]() June 2000 5 MIC5231 MIC5231 Micrel Applications Information Input Capacitor A 0.1 µF (or larger) capacitor should be placed from the IN (supply input) to GND (ground) if there is more than 20 cm of wire between IN and the ac filter capacitor or if supplied from a battery. Output Capacitors The MIC5231 does not require an output capacitor for stabil- ity. A 1 µF or larger capacitor is recommended between OUT (output) and GND to improve the regulator’s transient re- sponse. A 0.1 µF capacitor can be used to reduce overshoot recovery time at the expense of overshoot amplitude. The ESR (effective series resistance) of this capacitor has no effect on regulator stability, but low-ESR capacitors improve high frequency transient response. The value of this capaci- tor may be increased without limit, but values larger than 10 µF tend to increase the settling time after a step change in input voltage or output current. The MIC5231 has no minimum load current; it will remain stable and in regulation with no load (other than the internal voltage divider). This is especially important in real-time clock and CMOS RAM keep-alive applications. Minimum Load Current The MIC5231 does not require a minimum load for proper operation. This allows the device to operate in applications where very light output currents are required for keep-alive purposes. This is important for powering SRAM or Flash memory in low-power modes for handheld devices. Safe Operating Conditions The MIC5231 does not incorporate current limit or thermal shutdown in the design. The output pass element is approxi- mately 15 ohms, therefore, when a short occurs from the output to ground, the current is self-limited. The pass element has a positive temperature coefficient, such that when the device gets hot, the output impedance goes up, limiting the current even further. The maximum junction temperature for the device is 125 °C, and it is important that this is not exceeded for any length of time. Thermal Considerations The MIC5231 is not intended for sourcing currents that would cause a large power loss in the device, but since it is not current limited, it is possible to source more than the rated 10mA. At this point, it is important to ensure that the die temperature does not exceed 125 °C. Power dissipation in the regulator is calculated as follows: P D = (VIN – VOUT)*IOUT+ VIN *IGND The MIC5231 consumes only 0.65uA over load and does not need to consider that contribution in the power dissipation equation, therefore the equation is simplified. P D = (VIN – VOUT )*IOUT The MIC5231, in the IttyBitty SOT23-5 package, has a thermal resistance, junction-to-ambient, of 235 °C/W. Using this number, the power dissipation capability of that package, without exceeding a 125 °C junction temperature rating, can easily be calculated. P D(max) = (Tj(max) – Ta)/θJA P D(max) = (125°C – Ta)/235°C/W If the device is being operated at 85 °C, the maximum power Block Diagram IN OUT GND EN MIC5231 Bandgap Reference |
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