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W949D6KB Datasheet(PDF) 8 Page - Winbond

Part # W949D6KB
Description  Power Down Mode
PDF  60 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W949D6KB Datasheet(HTML) 8 Page - Winbond

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W949D6KB / W949D2KB
Publication Release Date: Dec. 11, 2014
Revision: A01-002
- 8 -
SIGNAL NAME
TYPE
FUNCTION
DESCRIPTION
CKE
Input
Clock Enable
CKE HIGH activates, and CKE LOW deactivates
internal clock signals, and device input buffers and
output drivers. Taking CKE LOW provides
PRECHARGE, POWER DOWN and SELF REFRESH
operation (all banks idle), or ACTIVE POWER DOWN
(row ACTIVE in any bank). CKE is synchronous for all
functions except for SELF REFRESH EXIT, which is
achieved asynchronously. Input buffers, excluding CK,
CK and CKE, are disabled during power down and self
refresh mode which are contrived for low standby power
consumption.
LDQS,UDQS (x16);
DQS0~DQ3 (x32)
I/O
Data Strobe
Output with read data, input with write data. Edge-
aligned with read data, centered with write data. Used
to capture write data.
x16: LDQS: DQ0~DQ7; UDQS: DQ8~DQ15.
x32: DQS0: DQ0~DQ7; DQS1: DQ8~DQ15;
DQS2: DQ16~DQ23; DQS3: DQ24~DQ31.
VDD
Supply
Power
Power supply for input buffers and internal circuit.
VSS
Supply
Ground
Ground for input buffers and internal circuit.
VDDQ
Supply
Power for I/O
Buffer
Power supply separated from VDD, used for output
drivers to improve noise.
VSSQ
Supply
Ground for I/O
Buffer
Ground for output drivers.
NC
-
No Connect
No internal electrical connection is present.
5.2
Addressing Table
Item
512 Mb
Number of banks
4
Bank address balls
BA0, BA1
Auto precharge ball
A10/AP
Type
Package
x16
Row addresses
A0-A12
Column addresses
A0-A9
tREFI(µs)
7.8
x32
Row addresses
A0-A12
Column addresses
A0-A8
tREFI(µs)
7.8



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