TLV702-Q1

SLVSC35B – AUGUST 2013 – REVISED JUNE 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

IN

–0.3

6

V

EN

–0.3

6

V

OUT

–0.3

6

V

Current (source)

OUT

Internally limited

A

Output short-circuit duration

Indefinite

–55

150

°C

Temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2

5.5

V

1.2

4.8

V

0

300

mA

–40

125

°C

–40

125

°C

6.4 Thermal Information

TLV702-Q1

DDC (SOT)

DSE (WSON)

UNIT

5 PINS

6 PINS

Junction-to-ambient thermal resistance

262.8

321.3

Junction-to-case (top) thermal resistance

68.2

207.9

Junction-to-board thermal resistance

81.6

281.5

°C/W

Junction-to-top characterization parameter

1.1

42.4

Junction-to-board characterization parameter

80.9

284.8

Junction-to-case (bottom) thermal resistance

N/A

142.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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