TLV702-Q1

SLVSC35B – AUGUST 2013 – REVISED JUNE 2015

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Table of Contents

1

Features .................................................................. 1

8

Application and Implementation ........................ 12

8.1

Application Information............................................ 12

2

Applications ........................................................... 1

8.2

Typical Application .................................................. 12

3

Description ............................................................. 1

9

Power Supply Recommendations ...................... 14

4

Revision History..................................................... 2

9.1

Power Dissipation ................................................... 14

5

Pin Configuration and Functions ......................... 3

10

Layout................................................................... 14

6

Specifications......................................................... 4

10.1

Layout Guidelines ................................................. 14

6.1

Absolute Maximum Ratings ...................................... 4

10.2

Layout Examples................................................... 15

6.2

ESD Ratings.............................................................. 4

11

Device and Documentation Support ................. 16

6.3

Recommended Operating Conditions ....................... 4

11.1

Device Support .................................................... 16

6.4

Thermal Information .................................................. 4

11.2

Documentation Support ........................................ 16

6.5

Electrical Characteristics........................................... 5

11.3

Community Resources.......................................... 16

6.6

Typical Characteristics .............................................. 6

11.4

Trademarks ........................................................... 16

7

Detailed Description ............................................ 10

11.5

Electrostatic Discharge Caution ............................ 16

7.1

Overview ................................................................. 10

11.6

Glossary ................................................................ 16

7.2

Functional Block Diagrams ..................................... 10

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 10

Information ........................................................... 17

7.4

Device Functional Modes........................................ 11

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (August 2013) to Revision B

Page

•

Added DSE (6-Pin WSON) package to data sheet ................................................................................................................ 1

•

Added Device Information, ESD Ratings, and Recommended Operating Conditions tables, and Detailed

Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation

Support, and Mechanical, Packaging, and Orderable Information sections to data sheet .................................................... 1

•

Deleted all references to P version of device throughout data sheet..................................................................................... 1

•

Added "Over Temperature" to 2% accuracy Features bullet ................................................................................................ 1

•

Changed DDC package name from TSOT23 to SOT throughout data sheet ........................................................................ 1

•

Changed Applications bullets ................................................................................................................................................. 1

•

Changed Description section text........................................................................................................................................... 1

•

Changed ceramic capacitor units on Typical Application circuit from mF to µF (typo) ......................................................... 1

•

Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement .................... 4

•

•

2

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