LE2464C

www.onsemi.com

4

Package Dimensions

unit : mm

WLP6(1.2

0.8) 0.33mm height

1.2±0.05

TOP VIEW

SIDE VIEW

BOTTOM VIEW

SIDE VIEW

A

0.4

0.2

2

1

3

S

φ0.05 M

AB

6 X φ0.20±0.05

S

S

0.08

WLCSP6, 0.80x1.20

CASE 567HM

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

---

MILLIMETERS

A1

D

0.80 BSC

E

b

0.15

0.25

e

0.40 BSC

0.33

E

D

A B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.08 C

6X

b

12

B

A

0.05 C

A

A1

C

0.03

0.13

1.20 BSC

PITCH

0.20

6X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.40

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

RECOMMENDED

A1

PACKAGE

OUTLINE

e

PITCH

3