CHP, HCHP

www.vishay.com

Vishay Sfernice

Revision: 19-May-14

3

Document Number: 52023

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

• Refer to Application Note “Guidelines for Vishay Sfernice

Resistive and Inductive Components” (document number:

52029) for recommended reflow profile. Profile #3 applies.

Note

• For temperature up to 215 °C please consult Vishay Sfernice

Note

CHIPS FOR HIGH FREQUENCY APPLICATIONS

The HF performance of flip chip and W/A types can be

improved on request.



Please ask for HCHP

POWER DERATING CURVE

PACKAGING

ESD packaging available: Waffle pack and plastic tape and

reel (low conductivity). Paper tapes available on request

(ESD only).

PACKAGING RULES

Waffle Pack

Can be filled up to maximum quantity indicated in the table

here above, taking into account the minimum order quantity.

When quantity ordered exceeds maximum quantity of a

single waffle pack, the waffle packs are stacked up on the

top of each other and closed by one single cover.

To get “not stacked up” waffle pack in case of ordered

quantity > maximum number of pieces per package:

Please consult Vishay Sfernice for specific ordering

code

Tape and Reel

See Part Numbering information to get the quantity desired

by tape.

MECHANICAL SPECIFICATIONS

Substrate

Alumina

Technology

Thick film (ruthenium oxyde)

Protection

Epoxy coating

Terminations

B (W/A):

SnPb over nickel barrier

for solder reflow

N (W/A):

SnAg over nickel barrier

for solder reflow

F (Flip Chip):

SnAg over nickel barrier

for solder reflow

W (one face) and G (W/A) type:

Gold over nickel barrier

for other applications

CLIMATIC SPECIFICATIONS

Operating temperature



range

- 55 °C; + 155 °C

OHMIC VALUE



RANGE in



TIGHTEST

TOLERANCE

(%)

BEST

TCR

(ppm/°C)

10

 < R < 5M

0.5 % (D)

100 (K)

5

 < R < 10M

1 % (F)

100 (K)

1

 < R < R

max.

2 % (G)

200 (L)

0.1

 < R < R

max.

5 % (J)

200 (L)

SIZE

MOQ

NUMBER OF PIECES PER

TAPE

WIDTH

WAFFLE

PACK

TAPE AND

MIN.

MAX.

0502

100

400

100

4000

8 mm

0505

100

0603

5000

0805



4000

1005

221

1206

140

1505

60

2010

2000

8 mm

1010

100

2500

8 mm

2208

60

4000

8 mm

1020

60

1000

8 mm

2512

50

2000

8 mm

070

20

40

60

80

100

120

140 155

0

20

40

60

80

100

Ambient Temperature in °C