CHPFR

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Vishay Sfernice

Revision: 19-Nov-14

2

Document Number: 52033

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

TYPICAL HF PERFORMANCE OF HCHP

POWER DERATING CURVE

PACKAGING

Waffle-pack or tape and reel when specified

Note

SUGGEESTED LAND PATTERN (please refer to IPC-7351A)

CLIMATIC SPECIFICATIONS

Operating temperature range

-55 °C; +155 °C

Thick film (ruthenium oxyde)

2.0

1.6

1.8

1.2

1.4

1.0

0.8

0.6

0.4

0.2

0

1

10

100

1000

10 000

f (MHz)

Size 0603 (W/A)

100 k

Ω

1 M

Ω

1 k

Ω

10 k

Ω

100

Ω

200

Ω

1

Ω

10

Ω

070

20

40

60

80

100

120

140 155

0

20

40

60

80

100

Ambient Temperature in °C

MECHANICAL SPECIFICATIONS

Substrate

Alumina

Technology

Thick film (ruthenium oxyde)

Protection

Epoxy coating

Terminations

B (W/A): SnPb over nickel

barrier for solder reflow

G (W/A) type: Gold over nickel

barrier for gluing

SIZE

NUMBER OF PIECES PER PACKAGE

TAPE

WIDTH

WAFFLE

PACK

2" x 2"

MIN.

MAX.

0603

100

100

5000

8 mm

0805

4000

1206

140

2010

60

2000

8 mm

2512

45

CHIP SIZE

0603

2.38

0.34

0.98

0805

2.77

0.73

1.40

1206

3.91

1.87

1.73

2010

5.94

3.64

2.67

2512

7.21

4.91

3.32

G

min.

Z

max.

X

max.